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Nanoprep-Model 5016
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Nanoprep-Model 5016

Nanoprep-Model 5016

Silicon back side preparation system
Back side thinning and more...

The NanoPrep CNC is designed to perform in package die thinning and polishing along with special machining functions for sample preparation. The die thinned and polished by the NanoPrep CNC are to all back side procedures such as IR emission microscopy and FIB editing. With optional software and hardware, it may make gaskets and other fixtures for use with RKD engineering. Nisene and NSC decapsulators. It can also perform mechanical decapsulation, removal of heat spreaders and heat sinks. It provides and easy to use solution for total back-side device preparation. The NanoPrep is a small, specially designed, CNC machining system controlled by a small hand held user interface that allows for the operator to select the desired function and enter the key device measurements. There is no need to know anything about machining or "G Code" to operate the hand held controller although a computer interface is provided that allows "G Code" programming.

Automatic tool touch-down detection and special alignment and leveling functions make setting up on a device fast and easy. Once a device has been processed, all process parameters can be saved as a process recipe. Up to 250 recipes can be saved, each with its own recipe name. A unique fixturing system allows for removing the device being processed for cleaning or inspection without remounting or re-aligning the device. A tilting fixture is provided with the system that allows for fast and accurate leveling. The included digital indicator allows leveling and touch-down accuracies of better than +/-2 microns.
  • Fast, easy set up - Including alignment and leveling
  • Simple operator interface with full process programmability
  • System automation of thinning and polishing processes
  • Programmable depth accurate to +/-5 microns
  • Removable sample holders-allows removal without re-mounting or aligning
  • Compliant tool holder system for grinding, lapping and polishing eliminates "stair stepping" and die cracking
  • Easy removal of heat spreaders, encapsulant, and die attach pad
  • Available and inexpensive tooling
  • Small footprint - takes little bench space

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