HOME> FA > Silicon Backside PreparationFA - Silicon Backside Preparation

UltraPrep
Specifications

       Large Die Backside Thinning with Minimal Thickness Variation




 

        UltraPrep is designed to perform in-package die thinning and polishing, plus       special machining functions for sample preparation. The die thnned and               polished   by UltraPrep are suited for all backside procedures because of the         surface   uniformity of the thinned and polished silicon.

                          

                                                                                                                  

                                                     

                                                       Die Contour of large dimension Flip Chip

NanoPrep
Specifications

       Silicon back side preparation system




Fast, easy set up, including alignment Simple operator interface with full process programmability.

System automation of thinning and polishing processes Programmable depth, accurate to +/- 5 microns.

Removable sample holders - allow removal of samples without remounting or realignment.